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 600V APT60D60B APT60D60BG*
60A APT60D60S APT60D60SG*
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
ULTRAFAST SOFT RECOVERY RECTIFIER DIODE
TO
PRODUCT APPLICATIONS
* Anti-Parallel Diode -Switchmode Power Supply -Inverters * Free Wheeling Diode -Motor Controllers -Converters -Inverters * Snubber Diode * PFC
PRODUCT FEATURES
* Ultrafast Recovery Times * Soft Recovery Characteristics
PRODUCT BENEFITS
* Low Losses * Low Noise Switching
1 2
-2 4
7
D3PAK
* Cooler Operation * Popular TO-247 Package or Surface Mount D3PAK Package * Higher Reliability Systems * Low Forward Voltage * Low Leakage Current * Increased System Power Density
1
2
1
2
1 - Cathode 2 - Anode Back of Case - Cathode
MAXIMUM RATINGS
Symbol VR VRRM VRWM IF(AV) IF(RMS) IFSM TJ,TSTG TL Characteristic / Test Conditions Maximum D.C. Reverse Voltage Maximum Peak Repetitive Reverse Voltage Maximum Working Peak Reverse Voltage
All Ratings: TC = 25C unless otherwise specified.
APT60D60B_S(G) UNIT
600
Volts
Maximum Average Forward Current (TC = 135C, Duty Cycle = 0.5) RMS Forward Current (Square wave, 50% duty) Non-Repetitive Forward Surge Current (TJ = 45C, 8.3ms) Operating and StorageTemperature Range Lead Temperature for 10 Sec.
60 132 600 -55 to 175 300
C Amps
STATIC ELECTRICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions IF = 60A VF Forward Voltage IF = 120A IF = 60A, TJ = 125C IRM CT Maximum Reverse Leakage Current Junction Capacitance, VR = 200V Microsemi Website - http://www.microsemi.com VR = 600V VR = 600V, TJ = 125C MIN TYP MAX UNIT
1.6 1.9 1.4
1.8
Volts
250 500 90
A pF
6-2006 053-6001 Rev I
DYNAMIC CHARACTERISTICS
Symbol trr trr Qrr IRRM trr Qrr IRRM trr Qrr IRRM Characteristic Reverse Recovery Time Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current Reverse Recovery Time Reverse Recovery Charge Maximum Reverse Recovery Current IF = 60A, diF/dt = -1000A/s VR = 400V, TC = 125C IF = 60A, diF/dt = -200A/s VR = 400V, TC = 125C IF = 60A, diF/dt = -200A/s VR = 400V, TC = 25C Test Conditions IF = 1A, diF/dt = -100A/s, VR = 30V, TJ = 25C MIN TYP
APT60D60B_S(G)
MAX UNIT ns nC
40 130 220 4 170 920 10 80 1900 38 -
-
Amps ns nC Amps ns nC Amps
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol RJC RJA WT Characteristic / Test Conditions Junction-to-Case Thermal Resistance Junction-to-Ambient Thermal Resistance Package Weight MIN TYP MAX UNIT C/W oz g
.34 40 0.22 5.9 10 1.1
lb*in N*m
Torque
Maximum Mounting Torque
Microsemi reserves the right to change, without notice, the specifications and information contained herein. 0.35 , THERMAL IMPEDANCE (C/W) 0.30 0.25 0.20 0.15 0.10 0.05 0 10 0.3 D = 0.9
0.7
0.5
Note:
PDM
t1 t2
Z
0.1 0.05
-5
SINGLE PULSE 10
-4
Duty Factor D = 1/t2 Peak TJ = PDM x ZJC + TC
JC
t
10-3 10-2 10-1 1.0 RECTANGULAR PULSE DURATION (seconds) FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
TJ (C)
6-2006
0.129 Dissipated Power (Watts) 0.0107 0.120
TC (C)
0.211 ZEXT are the external thermal impedances: Case to sink, sink to ambient, etc. Set to zero when modeling only the case to junction.
053-6001 Rev I
FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL
ZEXT
TYPICAL PERFORMANCE CURVES
200 180 IF, FORWARD CURRENT (A) 160 140 120 100 80 60 40 20 0 0 TJ = 125C TJ = 25C TJ = 150C TJ = -55C trr, REVERSE RECOVERY TIME (ns)
200 180 160 140 120 100 80 60 40 20 120A 60A
APT60D60B_S(G)
T = 125C J V = 400V
R
30A
0.5 1 1.5 2 2.5 VF, ANODE-TO-CATHODE VOLTAGE (V) Figure 2. Forward Current vs. Forward Voltage 2500 Qrr, REVERSE RECOVERY CHARGE (nC)
T = 125C J V = 400V
R
0 200 400 600 800 1000 1200 -diF /dt, CURRENT RATE OF CHANGE(A/s) Figure 3. Reverse Recovery Time vs. Current Rate of Change IRRM, REVERSE RECOVERY CURRENT (A) 40 35 30 25 20 15 10 5 0
T = 125C J V = 400V
R
0
120A
2000
120A 60A
1500
60A 30A
1000 30A 500
0 200 400 600 800 1000 1200 -diF /dt, CURRENT RATE OF CHANGE (A/s) Figure 4. Reverse Recovery Charge vs. Current Rate of Change 1.2
0
0 200 400 600 800 1000 1200 -diF /dt, CURRENT RATE OF CHANGE (A/s) Figure 5. Reverse Recovery Current vs. Current Rate of Change 160 140 120 IF(AV) (A) 100 80 60
Duty cycle = 0.5 T = 175C
J
trr
Kf, DYNAMIC PARAMETERS (Normalized to 1000A/s) 1.0 0.8 0.6 0.4 0.2 0.0
Qrr
trr IRRM
Qrr
40 20
25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (C) Figure 6. Dynamic Parameters vs. Junction Temperature
700 CJ, JUNCTION CAPACITANCE (pF) 600 500 400 300 200 100
0
75 100 125 150 175 Case Temperature (C) Figure 7. Maximum Average Forward Current vs. CaseTemperature
0
25
50
10 100 200 VR, REVERSE VOLTAGE (V) Figure 8. Junction Capacitance vs. Reverse Voltage
0
1
053-6001 Rev I
6-2006
Vr +18V 0V D.U.T. 30H diF /dt Adjust
APT60M75L2LL
APT60D60B_S(G)
trr/Qrr Waveform
PEARSON 2878 CURRENT TRANSFORMER
Figure 9. Diode Test Circuit
1 2 3 4
IF - Forward Conduction Current diF /dt - Rate of Diode Current Change Through Zero Crossing. IRRM - Maximum Reverse Recovery Current. Zero
1
4
5 3 2
trr - Reverse Recovery Time, measured from zero crossing where diode current goes from positive to negative, to the point at which the straight line through IRRM and 0.25 IRRM passes through zero. Qrr - Area Under the Curve Defined by IRRM and trr.
0.25 IRRM
5
Figure 10, Diode Reverse Recovery Waveform and Definitions
TO-247 Package Outline
e1 SAC: Tin, Silver, Copper
4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 6.15 (.242) BSC 15.49 (.610) 16.26 (.640) 5.38 (.212) 6.20 (.244)
D PAK Package Outline
e3 100% Sn
4.90 (.193) 5.10 (.201) 1.45 (.057) 1.60 (.063) 15.85 (.624) 16.05(.632) 13.30 (.524) 13.60(.535)
3
Cathode (Heat Sink)
1.00 (.039) 1.15(.045)
Cathode
20.80 (.819) 21.46 (.845) 3.50 (.138) 3.81 (.150)
18.70 (.736) 19.10 (.752) 0.40 (.016) 0.65 (.026)
12.40 (.488) 12.70 (.500)
4.50 (.177) Max.
6-2006
0.40 (.016) 0.79 (.031)
19.81 (.780) 20.32 (.800)
1.65 (.065) 2.13 (.084) 1.01 (.040) 1.40 (.055)
0.020 (.001) 0.250 (.010) 2.70 (.106) 2.90 (.114)
1.15 (.045) 1.45 (.057)
1.20 (.047) 1.90 (.075) 1.40 (.055) 2.10 (.083) 5.45 (.215) BSC (2 Plcs.)
2.40 (.094) 2.70 (.106) (Base of Lead)
053-6001 Rev I
Anode
2.21 (.087) 2.59 (.102)
Heat Sink (Cathode) and Leads are Plated
Cathode
10.90 (.430) BSC
Dimensions in Millimeters and (Inches)
Anode Cathode Dimensions in Millimeters (Inches)
Microsemi's products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.


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